McDermid "HiTech Resin Products" Corner Bond, etc.
Introducing products such as one-component thermosetting resins, one-component types, medium temperature range, and fast thermosetting options!
Seiwa Co., Ltd. handles "HiTech resin products" manufactured by McDermid. Founded in 1872, this American manufacturer has a global network and a wide adoption record under unified quality standards worldwide. In Japan, we also have a lab in Kanagawa (Hiratsuka) that supports everything from prototype condition setting to after-sales service after mass production begins, allowing customers to utilize various facility equipment themselves. Our product lineup includes epoxy materials for dispensing at BGA edges and corners called "Corner Bond," as well as one-component types, medium-temperature, and fast-curing "Potting Agents." "Underfill" is suitable for protecting solder joints of BGA, CSP, and flip-chip components. For more details, please refer to the related catalog. 【Product Types (Partial)】 ■ Underfill: High-speed penetration, thermal cycle resistance, etc. ■ Corner Bond: Adhesion at edges and corners ■ Potting Agent: Prevents cracks in small components *For more information, please refer to the PDF materials or feel free to contact us.
- Company：セイワ 東京本社、関西支社、名古屋営業所、中国無錫 グループ会社 エレクトロン（長野県松本市）
- Price：Other
